T3B3H
Features:
3.2mm x 5mm Ceramic SMD
3.3V Supply Voltage
CMOS Output
High Precision TCXO (VC option)
Electrical Specifications
| Frequency range | 5.000MHz to 52.000MHz | |
| Temperature Stability | Frequency Tolerance @25°C vs. Temp vs. Aging vs. Voltage (with a 5% change) vs. Load (with a 10% change) | ±2.0ppm Choose from available options ±1ppm per year max. ±0.05ppm ±0.05ppm |
| VDD Sensitivity | ||
| Operating Temperature Range | Choose from available options | |
| Storage Temperature Range | -55°C to +125°C | |
| Supply Voltage (VDD) | ±5% | 3.3VDC |
| Supply Current | 3.5mA Maximum | |
| Warm-up Time | ||
| Power Consumption | ||
| Output Voltage HCMOS | ||
| Output Voltage Logic High (VOH) | ||
| Output Voltage Logic Low (VOL) | ||
| Duty Cycle | ||
| Load Drive Capability | 10kOhms // 10pF | |
| Rise/Fall Time | ||
| Control Voltage Range | VDD = 3.3V | 1.65VDC ±1.5VDC |
| Transfer Function | Positive Transfer Characteristic | |
| Input Impedance | 100kOhms Minimum | |
| Linearity | ||
| Pullability | VC Option | ±5ppm |
| Output Type | Clipped Sinewave | |
| Output Voltage | 0.8Vp-p | |
| Start Up Time | ||
| Standby Current | ||
| RMS Phase Jitter | ||
| Phase Noise | at 12.800MHz | -130dBc/Hz at offset of 100Hz -145dBc/Hz at offset of 1kHz -154dBc/Hz at offset of 10kHz |
| Tristate Function | ||
| Pad 1 Connection | VC or No Connect | Choose from available options |
| Mechanical Trim | ||
| Aging | ||
| Tune Port Input Impedance | ||
| Tune Port Input Modulation Bandwidth | ||
| Differential Output (VOD) | ||
| Output Offset Voltage (VOS) | ||
| Differential Output Error (dVOS) | ||
| Crystal Cut |
Mechanical Dimensions
Part Numbering Guide
Environmental Specifications
| Fine Leak Test | MIL-STD-883, Method 1014, Condition A |
| Gross Leak Test | MIL-STD-883, Method 1014, Condition C |
| Mechanical Shock | MIL-STD-883, Method 1004 |
| Flammability | UL94-V0 |
| Moisture Resistance | MIL-STD-883, Method 1004 |
| Moisture Sensitivity | J-STD-020, MSL 1 |
| Resistance to Soldering Heat | MIL-STD-202, Method 210, Condition K |
| Resistance to Solvents | MIL-STD-202, Method 215 |
| Solderability | MIL-STD-883, Method 2003 |
| ESD Susceptibility | MIL-STD-883, Method 3015, Class 1, HBM: 1500V |
| Temperature Cycling | MIL-STD-883, Method 1010, Condition B |
| Vibration | MIL-STD-883, Method 2007, Condition A |
| Soldering Temp | |
| Hermeticity of Seal |
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